Velolink Semiconductor, Inc.

Datacenters
Datacenters
Provide high-performance high-speed interconnect solutions for high-density connectivity requirements of AI computing clusters.
Provide high-performance high-speed interconnect solutions for high-density connectivity requirements of AI computing clusters.
Design and produce 400G & 800G DSP's and 800G & 1.6T DSP's. Solutions for lower power consumption and exceptional signal integrity
Design and produce 400G & 800G DSP's and 800G & 1.6T DSP's. Solutions for lower power consumption and exceptional signal integrity
Supporting emerging LPO and CPO architectures to enable flexible configurations, higher bandwidth density, and lower TCO for AI training and high-performance computing.
Supporting emerging LPO and CPO architectures to enable flexible configurations, higher bandwidth density, and lower TCO for AI training and high-performance computing.


Commnuication
Commnuication
Provide advanced wireless and wired access solutions for next-generation communication networks.
Provide advanced wireless and wired access solutions for next-generation communication networks.
Our RF transceiver ICs enable 5G-A, millimeter-wave, and future 6G networks, supporting the evolution of mobile connectivity.
Our RF transceiver ICs enable 5G-A, millimeter-wave, and future 6G networks, supporting the evolution of mobile connectivity.
Through mass-production capabilities in Wi-Fi and satellite communication RF transceiver chips, we provide reliable semiconductor solutions for an increasingly connected world.
Through mass-production capabilities in Wi-Fi and satellite communication RF transceiver chips, we provide reliable semiconductor solutions for an increasingly connected world.
Automobile
Automobile
High-performance BMS AFE solutions for energy storage systems with mass-production capabilities.
High-performance BMS AFE solutions for energy storage systems with mass-production capabilities.
Supporting emerging LPO and CPO architectures to enable flexible configurations, higher bandwidth density, and lower TCO for AI training and high-performance computing.
Supporting emerging LPO and CPO architectures to enable flexible configurations, higher bandwidth density, and lower TCO for AI training and high-performance computing.



